MEMS-based variable capacitor

The variable capacitor of 7, wherein the upper electrode increases in width as a function of the distance from a free end of the upper electrode.

The variable capacitor device of 27, wherein each of the first and second pairs of actuation electrodes and the third pair of electrodes forming the variable capacitor includes a top electrode and a bottom electrode.

The variable capacitor device of 28, wherein each top actuation electrodes is formed on a dielectric layer that acts as a mechanical stop between such actuation electrodes and the bottom actuation electrodes.

The variable capacitor of 29, wherein at least one standoff is added to the dielectric layer on which the top actuation electrodes are formed, the at least one standoff preventing both the variable capacitor electrodes and the actuation electrodes from coming into contact during operation of the variable capacitor device to prevent dielectric charging or stiction.

The variable capacitor of 29, wherein at least one dimple is added to the dielectric layer on which the top actuation electrodes are formed, the at least one dimple preventing both the variable capacitor electrodes and the actuation electrodes from coming into contact during operation of the variable capacitor device to prevent dielectric charging or stiction.

The variable capacitor device of 28, wherein an electrostatic potential is applied to the two pair of actuation electrodes to produce an electrostatically generated force of attraction between said electrodes and cause the top activation electrodes to deflect and bend in the direction of the bottom activation electrodes, respectively, and thereby decreasing the gap between the top and bottom electrodes forming the variable capacitor.

The variable capacitor device of 28, wherein each of the pairs of activation electrodes has a gap between the top and bottom actuation electrodes greater than a gap between the top and bottom electrodes forming the variable capacitor. dimple preventing both the variable capacitor electrodes and the actuation electrodes from coming into contact during operation of the variable capacitor device to prevent dielectric charging or stiction.

The variable capacitor of 28, further including two additional pairs of electrodes on either side of the actuator electrodes, the two additional pairs of electrodes being fused together to lock the top variable capacitor electrode in a permanently deflected position to thereby fix the variable capacitor at a selected capacitance value.

The variable capacitor of 34, wherein the two additional pairs of electrodes are fused together by a current pulse of sufficient magnitude to slightly melt and fuse each of the additional pairs of electrodes together.

The variable capacitor of 34, wherein the two additional pairs of electrodes are fused together by a pulse from a high power laser of sufficient magnitude to weld each of the additional pairs of electrodes together.

The variable capacitor device of 37, wherein the first and second substrates are bonded together using a thermosetting polymer technique.

The variable capacitor device of 37, wherein the cavity provides a low-pressure, low humidity environment for the microelectromechanical device.

The variable capacitor device of 37, wherein a surface of the first LTCC substrate on which the microelectromechanical device is formed is micromachined to be smooth and uniform.

The variable capacitor device of 60, wherein the surface of the first LTCC substrate is micromachined by planarizing.

The variable capacitor device of 60, wherein the surface of the first LTCC substrate is micromachined by polishing.

The variable capacitor device of 37, wherein the thin-film materials are selected from the group consisting of gold, silver, platinum, and/or aluminum.

The variable capacitor device of 37, wherein the LTCC material has a dielectric constant of (εr) is 7.5+/−0.1 and a loss tangent is 0.001.

The variable capacitor device of 37, wherein the movable electrode is cantilevered.

The variable capacitor device of 37, wherein the mechanical stop is mounted on the fixed electrode.

The variable capacitor device of 67, wherein the variable capacitance means includes movable and fixed electrodes, and wherein the DC voltage applied to the electrodes controls the capacitance between the electrodes.

The variable capacitor device of 68, wherein the shape of the movable and fixed electrodes, in addition to the applied DC voltage, controls the capacitance between the electrodes.

The variable capacitor device of 68, wherein the device is electronically tunable to a selected value and wherein a predetermined actuation voltage is applied to the movable and fixed electrodes to maintain the capacitor device at the selected value.

The variable capacitor device of 68, wherein the variable capacitor is tuned to a selected value and a short, low-voltage, high-current pulse of sufficient duration to essentially “weld” the electrodes together at the selected capacitance value is applied.

The variable capacitor device of 68, wherein the electrodes are welded by a high-powered laser to a tuned position whereby the device is locked into a selected capacitance value.

The variable capacitor device of 67, wherein the supporting and enclosing means bonded together contains a cavity containing a partial vacuum or an inert ambient gas to facilitate the operation and reliability of the variable capacitance means.

The variable capacitor device of 74, wherein the cavity provides a low-pressure, low humidity environment for the microelectromechanical device.

The variable capacitor device of 67, wherein the supporting and enclosing means include continuous electrical connections through their respective layers.

The variable capacitor device of 67, wherein the LTCC material has low resistive losses at frequencies above 30 GHz.

The variable capacitor device of 67, wherein thin-films of materials are deposited, patterned and etched on a surface of the supporting means to form the variable capacitance means.

The variable capacitor device of 67, wherein each LTCC layer includes means for incorporating electrical connections and interconnections, through wafer vias, discrete components, sealable cavities, and bonded integrated circuits.

The variable capacitor device of 67, wherein the LTCC material has a low loss tangent and a high k factor value for high performance high-frequency applications.

The variable capacitor device of 79, wherein the thin-film materials are selected from the group consisting of gold, silver, platinum, and/or aluminum.

The variable capacitor device of 67, wherein the supporting and enclosing means are bonded together using eutectic bonding.

The variable capacitor device of 67, wherein the supporting and enclosing means are bonded together using a glass-frit technique.

The variable capacitor device of 67, wherein the supporting and enclosing means are bonded together using a thermosetting polymer technique.

The variable capacitor device of 67, wherein a surface of the supporting means on which the variable capacitance means is formed is micromachined to be smooth and uniform.

The variable capacitor device of 86, wherein the surface of the supporting means is micromachined by planarizing.

The variable capacitor device of 86, wherein the surface of the supporting means is micromachined by polishing.

The variable capacitor device of 67, wherein the LTCC material has a dielectric constant of (εr) is 7.5+/−0.1 and a loss tangent is 0.001.

The variable capacitor device of 90, wherein each movable actuation electrodes is formed on a dielectric layer that acts as a mechanical stop between such actuation electrodes and the bottom actuation electrodes.

The variable capacitor of 91, wherein at least one standoff is added to the dielectric layer on which the top actuation electrodes are formed, the at least one standoff preventing both the variable capacitor electrodes and the actuation electrodes from coming into contact during operation of the variable capacitor device to prevent dielectric charging or stiction.

The variable capacitor of 91, wherein at least one dimple is added to the dielectric layer on which the top actuation electrodes are formed, the at least one dimple preventing both the variable capacitor electrodes and the actuation electrodes from coming into contact during operation of the variable capacitor device to prevent dielectric charging or stiction.

The variable capacitor device of 91, wherein an increased amount of area of the variable capacitor movable electrode is brought into contact with the mechanical stop in a zipper-like motion as the applied DC voltage is increased, whereby the capacitance between said movable electrode and the variable capacitor fixed electrode is varied as the amount of area of said movable electrode contacting the mechanical stop is varied.

The variable capacitor device of 90, wherein an electrostatic potential is applied to the two pair of actuation electrodes to produce an electrostatically generated force of attraction between said actuation electrodes and cause the top actuation electrodes to deflect and bend in the direction of the bottom actuation electrodes, respectively, and thereby decreasing the gap between the top and bottom electrodes forming the variable capacitor.

The variable capacitor device of 90, wherein each of the pairs of actuation electrodes has a gap between the top and bottom actuation electrodes greater than a gap between the top and bottom electrodes forming the variable capacitor.

The variable capacitor of 90, further including two additional pairs of electrodes on either side of the actuation electrodes, the two additional pairs of electrodes being fused together to lock the movable variable capacitor electrode in a permanently deflected position to thereby fix the variable capacitor at a selected capacitance value.

The variable capacitor of 98, wherein the two additional pairs of electrodes are fused together by a current pulse of sufficient magnitude to slightly melt and fuse each of the additional pairs of electrodes together.

The variable capacitor of 98, wherein the two additional pairs of electrodes are fused together by a pulse from a high power laser of sufficient magnitude to weld each of the additional pairs of electrodes together.

The variable capacitor of 98, wherein the first and second substrates are formed from multiple layers of low temperature co-fired ceramic.

The variable capacitor of 90, wherein the upper electrode forming the variable capacitor is shaped so as to create a substantially linear relationship between the applied DC voltage and the deflection of said upper electrode and thereby the capacitance between the upper and lower electrodes forming the variable capacitor.