Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same

An electronic circuit part which is formed by electrically connecting an electrode section of an electronic circuit element and an electrode section of an electronic circuit substrate,

• wherein the connection is formed by using a laminated conductive fine particle provided with a conductive metal layer around a spherical elastic base particle by electroless plating and electroplating and, further on the surface of the conductive metal layer, a low-melting-point metal layer,
• the conductive metal layer comprises a plurality of metal layers,
• the low-melting-point metal layer is formed by at least one element having a melting point of not more than 260° C. selected from the group consisting of tin, lead, bismuth, silver, zinc, indium, and copper, and
• the electrical connection is formed by one laminated conductive fine particle per each connecting section at each of connecting sections between the conductive metal layer and the low-melting-point metal layer of the laminated conductive fine particles and the electrode section of the electrode circuit element.

An electronic circuit element or an electronic circuit substrate, which is connected by a conductive fine particle, wherein a bonding strength F (unit:

• gr) between the conductive fine particle and an electrode section of an electronic circuit element or an electrode section of an electronic circuit substrate is set in a range represented by [Formula 2}:
• 500×D′×D′(gr/mm mm)<F<8000×D′×D′(gr/mm mm) [Formula 2]
• wherein D′ represents the diameter (unit:
• mm) of the conductive fine particle,
• the conductive fine particle is a laminated conductive fine particle provided with a conductive metal layer on the surface of a spherical elastic base particle by electroless plating and electroplating and, further on the surface of the conductive metal layer, a low-melting-point metal layer,
• the conductive metal layer comprises a plurality of metal layers, and
• the low-melting-point metal layer is formed by at least one element having a melting point of not more than 260° C. selected from the group consisting of tin, lead, bismuth, silver, zinc, indium, and copper.