High frequency power amplifier module and wireless communication apparatus

A high frequency power amplifier module, comprising:

• a high frequency power amplifier and a bias control circuit, which are monolithically formed on a single semiconductor chip which is mounted on a module and which includes a first input terminal, a second input terminal, a first output terminal, and a second output terminal,
• wherein said high frequency power amplifier includes:
• a first amplifying system coupled to the first input terminal and to the first output terminal, and including a plurality of first bias terminals, and a plurality of amplifying stage, which are sequentially cascaded between said first input terminal and said first output terminal and each of which is coupled to a corresponding one of the plurality of first bias terminal a so as to receive a bias potential therefrom, wherein each of said amplifying stages includes a MOSFET having a first conductivity type and a gate coupled to the corresponding first bias terminal, and
• a second amplifying system coupled to the second input terminal and to the second output terminal, and including a plurality of second bias terminals, and a plurality of amplifying stages which are sequentially cascaded between said second input terminal and said second output terminal and each of which is coupled to a corresponding one of the plurality of second bias terminals so as to receive a bias potential therefrom, wherein each of said amplifying stages includes a MOSFET having the first conductivity type and a gate coupled to the corresponding second bias terminal,
• wherein said bias control circuit includes a first MOSFET of the first conductivity type and a second MOSFET of a second conductivity type different from the first conductivity type and is coupled to the plurality of first bias terminals and to the plurality of second bias terminals.