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AssigneeApplied Materials, Inc.
InventorsAlain Duboust, Lizhong Sun, Feng Q. Liu, Yuchun Wang, Yan Wang, Siew Neo, Liang-Yuh Chen
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An electrolyte composition and method for planarizing a surface of a wafer using the electrolyte composition is provided. In one aspect, the electrolyte composition includes ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof. The composition has a pH between about 3 and about 10 which is environmentally friendly and does not present hazardous operation concerns. The composition may further comprise one or more additives selected from a group consisting of benzotriazole, ammonium citrate, ethlylenediamine, tetraethylenepentamine, triethylenetetramine, diethylenetriamine, amino acids, ammonium oxalate, ammonia, ammonium succinate, and citric acid.
A method for planarizing a surface of a wafer, comprising polishing the wafer in an electrolyte composition comprising a phosphate system having a pH from about 3 to about 10, wherein the wafer is connected to an electrical power source, and wherein the phosphate system comprises ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof.
A method for planarizing a surface of a wafer, comprising polishing the wafer in an electrolyte composition comprising a phosphate system having a pH from about 3 to about 10, wherein the wafer is connected to an electrical power source, and wherein the electrolyte composition further comprises one or more additives selected from the group consisting of benzotriazole, ammonium citrate, citric acid, and ammonia.
A method for planarizing a surface of a wafer, comprising:
A method for planarizing a surface of a wafer, comprising:
A method for electrochemically polishing a substrate, comprising:
An electrolyte composition comprising about 2 to about 23 percent by weight of ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof in volume of total solution and one or more additives selected from the group consisting of benzotriazole, ammonium citrate, ethlylenediamine, tetraethylenepentamine, triethylenetetramine, diethylenetriamine, amino acids, ammonium oxalate, ammonia, ammonium succinate, and citric acid.
The composition of claim 38 wherein the electrolyte composition comprises about 0.01 to about 2 percent of benzotriazole by weight in volume of total solution and about 2 to about 15 percent of ethylenediamine by weight in volume of total solution.
A method for planarizing a surface of a wafer, comprising polishing the wafer in an electrolyte composition comprising ammonium dihydrogen phosphate, diammonium hydrogen phosphate, or a mixture thereof, wherein the wafer is connected to an electrical power source.
A method for planarizing a surface of a wafer, comprising:
Dependencies are inferred from the claim text.