Aperture masks for circuit fabrication
Assignee3M Innovative Properties Company
InventorsPaul F. Baude, Patrick R. Fleming, Michael A. Haase, Tommie W. Kelley, Dawn V. Muyres, Steven Theiss
Life of this patent
Estimating the term…
Abstract
Aperture masks and deposition techniques for using aperture masks are described. In addition, techniques for creating aperture masks and other techniques for using the aperture masks are described. The various techniques can be particularly useful in creating circuit elements for electronic displays and low-cost integrated circuits such as radio frequency identification (RFID) circuits. In addition, the techniques can be advantageous in the fabrication of integrated circuits incorporating organic semiconductors, which typically are not compatible with wet processes.
Claims10
A method comprising:
- positioning a repositionable polymeric aperture mask in proximity to a deposition substrate;
- stretching the aperture mask to align the aperture mask with the deposition substrate;
- and
- depositing material through the stretched aperture mask to form a layer on the deposition substrate.
A method comprising depositing material on a deposition substrate through a repositionable polymeric aperture mask to define a patterned layer of an integrated circuit, wherein the aperture mask includes a patterned area with a dimension greater than a centimeter, and wherein the patterned layer of the integrated circuit comprises at least a portion of a thin film transistor.
Dependencies are inferred from the claim text.