Loading patent…
AssigneesInfineon Technologies SC300 GmbH & Co. KG, Infineon Technologies AG, Motorola, Inc.
InventorsKarl Mautz, Sebastian Schmidt, Thorsten Schedel
Estimating the term…
Processing parameters of at least one plate-shaped object, e.g. a semiconductor device or wafer, or a flat panel display, in a processing tool are adjusted depending on which processing device out of at least one set of processing devices has been used for the semiconductor device in a preceding step. A virtual or physical tag is generated, which connects the semiconductor device identification with the processing device identification. This enables a compensation of tool-dependent effects in previous processing of a single device. An example is chemical mechanical polishing prior to lithography, where alignment marks can be deteriorated differently between CMP-units. The amount of compensation is detected and evaluated by metrology tools, which—depending on the sequence of the metrology step relative to the processing step to be adjusted—either feed-forward or feed-backward their results to the processing tool. The yield of semiconductor device production is advantageously increased.
A method for adjusting process parameters for at least one plate-shaped object in a processing tool, the plate-shaped object having experienced at least one preceding processing step performed by one processing device out of at least one set of processing devices, an adjustment in the processing tool being controlled by a control unit, which comprises the steps of:
Dependencies are inferred from the claim text.