Measuring method, inspection method, inspection device, semiconductor device, method of manufacturing a semiconductor device, and method of manufacturing an element substrate

A method of manufacturing a semiconductor device, comprising:

• forming at least a pixel portion comprising a first thin film transistor and a drive circuit comprising a second thin film transistor over a substrate;
• operating the pixel portion and the drive circuit by applying a voltage to the pixel portion and the drive circuit in a non-contact manner;
• forming a modulated signal by modulating an ac voltage with a voltage output from the pixel portion and the drive circuit;
• reading a voltage of the modulated signal in a non-contact manner;
• and
• inspecting the operating condition of the pixel portion and the drive circuit in a non-contact manner.

A method of manufacturing an article, comprising:

• manufacturing a circuit or a circuit element, a first coil, a second coil, a third coil, and a fourth coil;
• applying a first ac voltage between a pair of terminals of the first coil;
• overlapping the first coil and the second coil with a certain spacing set therebetween;
• forming a signal for operating the circuit or the circuit element from a second ac voltage generated between a pair of terminals of the second coil;
• operating the circuit or the circuit element by inputting the signal to the circuit or the circuit element;
• forming a modulated signal by modulating a third ac voltage with a voltage output from the circuit or the circuit element;
• applying a voltage of the modulated signal between a pair of terminals of the third coil;
• overlapping the third coil and the fourth coil with a certain spacing set therebetween;
• and
• inspecting an operating condition of the circuit or the circuit element through a fourth ac voltage generated between a pair of terminals of the fourth coil.

A method of manufacturing a semiconductor device, comprising:

• forming at least a pixel portion comprising a first thin film transistor and a drive circuit comprising a second thin film transistor, a first coil, and a second coil, over a substrate;
• applying a first ac voltage between a pair of terminals of a third coil;
• overlapping the first coil and the third coil with a certain spacing set therebetween;
• forming a signal for operating the pixel portion and the drive circuit from a second ac voltage generated between a pair of terminals of the second coil;
• operating the pixel portion and the drive circuit by inputting the signal to the pixel portion and the drive circuit;
• forming a modulated signal by modulating a third ac voltage with a voltage output from the pixel portion and the drive circuit;
• applying a voltage the modulated signal between a pair of terminals of a fourth coil;
• overlapping the second coil and the fourth coil with a certain spacing set therebetween;
• and
• inspecting an operating condition of the pixel portion and the drive circuit through a fourth ac voltage generated between a pair of terminals of the second coil, in a non-contact manner.