High frequency module board device

A high frequency module board device comprising:

• a base board comprising a plurality of wiring layers, with an insulating layer between adjacent wiring layers wherein an upper-most wiring layer of the base board provides a build-up surface;
• and
• an insulating layer formed over said base board;
• and
• a high frequency circuit part having one or more wiring layers with an insulating layer between each wiring layer formed over the build-up surface of the base board;
• wherein the base board has an area in which wiring is not formed at least at a portion of the second wiring layer located directly below a location at which the high frequency module board has a portion of a capacitance formed, the capacitance being formed such that an upper electrode is formed in the high frequency circuit part at a position above the build-up, surface corresponding to the area in which the wiring is not formed and a lower electrode is formed in the base board at a position of the upper-most wiring layer corresponding to the area in which the wiring is not formed.

A high frequency module board device comprising:

• a base board comprising a plurality of wiring layers, with an insulating layer between adjacent wiring layers wherein an upper-most wiring layer of the base board a build-up surface;
• and
• an insulating layer formed over said base board;
• and
• a high frequency circuit part having two or more wiring layers with an insulating layer formed between each wiring layer, formed over the build-up surface of the base board;
• wherein the base board has an area in which wiring is not formed at least at a portion of the second wiring layer located directly below a location at which the high frequency circuit part has a first capacitance formed, the capacitance being formed such that an upper electrode and a lower electrode are formed in the high frequency part at positions above the build-up surface respectively corresponding to the area in which the wiring is not formed, and a second capacitance formed in such a way that a third electrode is formed in the base board at a position of the upper-most wiring layer corresponding to the area in which the wiring is not formed and the third electrode is interconnected to the upper electrode of the first capacitance.

A high frequency module board device comprising:

• a base board comprising a plurality of wiring layers with an insulating layer between adjacent wiring layers, wherein a top surface of an upper-most wiring layer of the base board is a build-up surface;
• and
• a high-frequency circuit part having at least two wiring layers with an insulating layer between each wiring layer secured to the base board,
• wherein the base board has an area in which wiring is not formed at least in the upper-most wiring layer and the high frequency circuit part has a capacitance formed in such a way that an upper electrode and a lower electrode are formed at positions respectively corresponding to the area in which the wiring is not formed.