Low cost optical bench having high thermal conductivity
AssigneeCorning Incorporated
InventorMark A. Shaw
Life of this patent
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AssigneeCorning Incorporated
InventorMark A. Shaw
Estimating the term…
The invention relates with an optical bench for optoelectronic packages comprising a rigid insulating substrate, the substrate having a top surface along which it is defined an optical axis, the substrate comprising: a device region for mounting at least an optoelectronic device in alignment with the optical axis, and a fixing region adjacent to the device region for affixing at least an optical component in alignment with the optical axis. The substrate further comprises a third region provided with metallised tracks, the third region extending over the substrate top surface along at least part of one side of the fixing region in a direction substantially parallel to the optical axis. The invention also relates with an optical bench comprising: a single baseplate having a device region and a fixing region; a welding platform mounted directly on said fixing region; a heat sink mounted directly on said device region; and an optoelectronic device directly mounted on said heat sink.
An optical bench for optoelectronic packages comprising a rigid insulating substrate, said substrate having a top surface along which it is defined an optical axis, said substrate comprising:
A packaged optoelectronic device comprising:
Dependencies are inferred from the claim text.