Laminated substrate, method of producing the same, nonreciprocal circuit element, and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorTakashi Hasegawa
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Abstract
A laminated substrate includes a dielectric sheet having center electrode connecting electrodes, a dielectric sheet having ground connecting electrodes and viaholes, a dielectric sheet having hot-side capacitors, a circuit electrode, and a resistor disposed thereon, a dielectric sheet having hot-side capacitor electrodes disposed on the surface thereof, and dielectric sheets having ground electrodes disposed on the surfaces thereof, respectively. The laminated substrate includes matching capacitors and a terminal resistor disposed inside thereof. The matching capacitors are trimmed before the matching capacitors are connected to center electrodes, respectively.
Claims14
A laminated substrate comprising:
- a laminated member including a plurality of laminated dielectric layers;
- center electrode connecting electrodes disposed on a surface of the laminated member to be electrically connected to center electrodes of a nonreciprocal circuit element;
- and
- at least two capacitor electrodes disposed inside of the laminated member;
- the at least two capacitor electrodes being opposed to each other with one of the dielectric layers being interposed between the at least two capacitor electrodes to define a capacitor, and the capacitor being electrically connected to one of the center electrode connecting electrodes, and the at least one of the at least two capacitor electrodes being a trimming capacitor electrode.
Dependencies are inferred from the claim text.