Back to results
US 6,888,257 B2Granted
Interface adhesive
AssigneeLord Corporation
InventorsMark B. Wilson, James H. Hogan, Michael L. Owen
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeLord Corporation
InventorsMark B. Wilson, James H. Hogan, Michael L. Owen
Estimating the term…
The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.
A die assembly comprising:
A heat cured, thermal interface material comprising an adhesive capable of exhibiting a cured bulk thermal conductivity of 5 to 27 W/mK, comprising 75% to 90% by weight of thermally conductive particulate filler, and from 10% to 25% by weight of organic component, said organic component comprising from 60% to 70% by weight of a diglycidal ether of bisphenol compound, 4 to 30% by weight of a acyclic aliphatic, cycloaliphatic or mononuclear aromatic diglycidal ether having an epoxy equivalent weight of less than 200, from 3% to 30% of a monofunctional epoxy compound having an equivalent weight of less than 250 and from 20% to 30% of a polyamine-anhydride adduct having a melting point of from 60° to 200° C., all percentages totaling 100% of said organic component.
Dependencies are inferred from the claim text.