Compliant relief wafer level packaging

A method for forming a semiconductor structure, said method comprising:

• providing a semiconductor substrate;
• providing a compliant interconnect element on a first surface of the substrate, said compliant interconnect element comprising a portion extending across and away from the first surface of the substrate to define a chamber between the portion of the compliant interconnect element and the first surface of the substrate;
• disposing a first conducting pad on the substrate;
• disposing a conducting layer on the compliant interconnect element in contact with the first conducting pad;
• and
• disposing a plurality of conducting pads on the substrate,
• wherein the conductive layer comprises a plurality of lines, each of the lines contacting one of the plurality of conducting pads, the lines defining a pad redistribution pattern, the plurality of conducting pads have a first pitch and the lines define a pad distribution pattern have a second pitch.