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US 6,888,255 B2Granted
Built-up bump pad structure and method for same
AssigneeTexas Instruments Incorporated
InventorsMasood Murtuza, Muthiah Venkateswaran, Satyendra Singh Chauhan
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Abstract
In accordance with the present invention, a built-up bump pad structure and method for the same are provided. The bump pad structure includes a substrate, a bump pad disposed upon the substrate, a solder mask disposed upon the substrate defining an opening around the bump pad, and a conductive material deposited upon the bump pad such that the conductive material at least partially fills the opening around the bump pad.
Claims10
A bump pad structure, comprising:
- a substrate;
- a bump pad disposed upon the substrate;
- a solder mask disposed upon the substrate defining an opening around the bump pad;
- and
- a plated conductive material or a printed conductive material upon the bump pad which at least partially fills the opening around the bump pad.
2 more elements
A method for preparing a bump pad structure, comprising:
- depositing a bump pad upon a substrate;
- depositing a solder mask upon the substrate such that the solder mask defines an opening around the bump pad;
- and
- plating or printing a conductive material upon the bump pad such that the conductive material at least partially fills the opening around the bump pad.
1 more element
Dependencies are inferred from the claim text.