Interconnect arrangement and method for fabricating an interconnect arrangement
AssigneeInfineon Technologies AG
InventorsManfred Engelhardt, Guenther Schindler
Life of this patent
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Abstract
An interconnect arrangement (100) has a first layer (101), a first layer surface (102), thereon at least two interconnects (104) having a second layer surface (105) essentially parallel to the first layer surface (102), thereon a respective second layer (106) for each interconnect (104), the second layers (106) of adjacent interconnects covering regions between the adjacent interconnects (104), and thereon a third layer (107), which completely closes off the regions between the adjacent interconnects (104) by means of coverage.
Claims22
Interconnect arrangement, comprising:
- a first layer and a first layer surface, the first layer having a first insulation material;
- at least two interconnects situated on the first layer surface, having a second layer surface essentially parallel to the first layer surface, the interconnects having a first material which is electrically conductive;
- a second layer made of a second insulation material, which second layer is produced on the second layer surface of each interconnect and projects beyond the interconnect, the second layers of adjacent interconnects covering regions between the adjacent interconnects;
- a third layer covering the second layers, the third layer having a third insulation material and completely closing off the regions between the adjacent interconnects by means of coverage;
- and
- a cavity between the first layer, the adjacent interconnects, the second layers and the third layer, the cavity having an electrically insulating effect between the adjacent interconnects.
Method for fabricating an interconnect arrangement, comprising:
- applying at least two interconnects on a first layer surface of a first layer, the interconnects having a second layer surface essentially parallel to the first layer surface and sidewalls situated between the first layer surface and the second layer surface and also an electrically conductive first material and the first layer having a first insulation material;
- producing, for each interconnect, a second layer made of a first insulation material on the second layer surface, each second layer being arranged in such a way that the second layer projects beyond the interconnect and adjacent second layers are still not touched;
- and producing a third layer made of a third insulation material above the second layers, as a result of which an Interconnect arrangement is formed between the first layer, the adjacent interconnects, the second layer and the third layer.
Dependencies are inferred from the claim text.