Low warpage flip chip package solution-channel heat spreader
AssigneeAltera Corporation
InventorYuan Li
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a chip carrier to receive a semiconductor with a dimension generally greater than 22 mm. The chip carrier has a first coefficient of thermal expansion that is larger than the coefficient of thermal expansion of the semiconductor. A heat spreader having parallel channels on opposite sides is attached to the chip carrier along the channels. The heat spreader has a second coefficient of thermal expansion that is smaller than or equal to the coefficient of thermal expansion of the chip carrier. The interplay between the heat spreader and the chip carrier can effectively reduce package warpage and maintain coplanarity within the specification.
Claims21
An electronic package, comprising:
- a substrate having a first surface and four edges;
- an electronic device having two long edges and two short edges and mounted on the first surface of the substrate, each device edge being parallel to one of the four substrate edges;
- and
- a heat spreader with a lid and only two parallel sidewalls extending therefrom, each sidewall being attached to the first surface of the substrate along one edge of the substrate;
- wherein each of the two short device edges is substantially closer to its parallel substrate edge than each of the two long device edges is to its parallel substrate edge such that there is more space on the substrate between each of the two long device edges and its parallel substrate edge than between each of the two short device edges and its parallel substrate edge for receiving the two parallel sidewalls of the heat spreader.
A semiconductor package, comprising:
- a substrate having four edges;
- a semiconductor device having two long edges and two short edges and mounted on a first side of the substrate through a plurality of solder joints, each device edge being parallel to one of the four substrate edges;
- and
- a heat spreader mounted on the first side of the substrate covering the semiconductor device, the heat spreader having a lid and only two parallel sidewalls extending therefrom, each sidewall being attached to the first side of the substrate along one edge of the substrate;
- wherein each of the two short device edges is substantially closer to its parallel substrate edge than each of the two long device edges is to its parallel substrate edge such that there is more space on the substrate between each of the two lone device edges and its parallel substrate edge than between each of the two short device edges and its parallel substrate edge for receiving the two parallel sidewalls of the heat spreader.
Dependencies are inferred from the claim text.