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US 6,888,237 B1Granted
Encapsulation of a device
AssigneeOSRAM GmbH
InventorEwald Karl Michael Guenther
Life of this patent
Estimating the term…
Abstract
An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package.
Claims26
A device comprising:
- a substrate having active and non-active regions, wherein the non-active regions are between the active regions;
- an active component in at least one of the active regions;
- a cap support in a periphery of the device and in the at least one non-active region;
- and
- a cap on the cap support, forming a cavity between the active component and the cap;
- wherein the substrate, cap support and cap together form a flexible device.
3 more elements
Dependencies are inferred from the claim text.