Ceramic substrate for manufacture/inspection of semiconductor
AssigneeIbiden Co., Ltd.
InventorsYasuji Hiramatsu, Yasutaka Ito, Atsushi Ozaki
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Abstract
A ceramic substrate for a semiconductor producing/examining device which has high fracture toughness value, excellent thermal shock resistivity, high thermal conductivity and an excellent temperature rising and falling properties, can be used as a hot plate, an electrostatic chuck, a wafer prober and the like. A ceramic substrate, for a semiconductor producing/examining device, having a conductor formed inside or on the surface thereof has been sintered such that a fractured section thereof exhibits intergranular fracture.
Claims26
A ceramic substrate having a conductor inside thereof,
- wherein the ceramic substrate is a sintered aluminum nitride substrate having a disc shape and a fractured section with intergranular fracture, and
- at least one rare earth element is locally distributed in triple points of crystal grains.
A ceramic substrate comprising a conductor on a surface thereof,
- wherein the ceramic substrate is a sintered aluminum nitride substrate having a disc shape and a fractured section with intergranular fracture, and
- at least one rare earth element is locally distributed in triple points of crystal grains.
Dependencies are inferred from the claim text.