Apparatus for routing signals
AssigneeHewlett-Packard Development Company, L.P.
InventorsJames P. Slupe, Timothy V. Harper, Fred R. Wiedeback
Life of this patent
Estimating the term…
Abstract
An apparatus for routing signals to and from at least one circuit component that has a plurality of input/output leads includes a support structure having a first side and a second side. The first side is adapted to have the input/output leads of the circuit component attached thereto. A signal routing strip having a first end and a second end is also included. The first end of the routing strip is configured and adapted to be electrically connected to the input/output leads of the circuit component for transmitting signals to and from the circuit component.
Claims10
An integrated circuit device comprising:
- a die for performing functions of said integrated circuit device, and having a plurality of input/output terminals;
- a package configured and adapted to receive said die, and having a first surface and an opposing second surface;
- and,
- a plurality of external connection terminals formed on said first surface and said second surface of said package;
- wherein said input/output terminals of said die are respectively electrically connected by solder ball terminals located at the interface of said conductors and said input/output terminals of said die to one end of conductors embedded in said package, the opposite end of said embedded conductors extending to said external connection terminals on said first surface and said second surface of said package.
A stackable integrated circuit device adapted to have at least one circuit component attached thereto, said device comprising:
- a die for performing functions of said integrated circuit device, and having a plurality of input/output terminals;
- a package configured and adapted to receive said die, and having a first surface and an opposing second surface;
- and,
- a plurality of external connection leads formed on said first surface and said second surface of said package, said external connection leads being electrically connected to said input/output terminals of said die;
- wherein said external connection leads on said first surface are configured and adapted to be connected by solder ball terminals to corresponding input and output leads of the circuit component placed over said first surface of said package.
Dependencies are inferred from the claim text.