Embedded capacitor multi-chip modules
AssigneeRaytheon Company
InventorsDennis R. Kling, Christopher D. Cotton, Bruce W. Chignola
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Abstract
The invention provides systems and methods for interconnecting circuit devices, wherein decoupling capacitors are disposed on a substrate and an interconnect layer having a pattern of circuit connections is formed by a deposition process over the capacitors thereby embedding the decoupling capacitors within the interconnect layer. Circuit devices can be mounted to the surface of the deposited interconnect layer at locations that minimize, or substantially minimize, the interconnect length between the chip device and the decoupling capacitors for that circuit device.
Claims12
A device for interconnecting a plurality of circuit devices, comprising:
- a decoupling capacitor mounted on a first surface and having a grounding pad and a power pad formed on a top surface of said decoupling capacitor;
- and
- an interconnect layer having a pattern of circuit connections and being formed over said top surface of said decoupling capacitor, whereby electrical connections to said decoupling capacitor are embedded within said interconnect layer and said interconnect layer is disposed between said decoupling capacitor and said plurality of circuit devices,
- and whereby said pattern of circuit connections of said interconnect layer is coupled to said decoupling capacitor and said plurality of circuit devices, said pattern of circuit connections coupling to said grounding pad and said power pad of said decoupling capacitor.
Dependencies are inferred from the claim text.