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US 6,888,209 B2Granted
Semiconductor package and method of fabricating the same
AssigneeCasio Computer Co., Ltd.
InventorHiroyasu Jobetto
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a semiconductor substrate having a device region on one surface thereof, and a connecting pad electrically connected to the device region. A support substrate is formed on a side of one surface of the semiconductor substrate. An external electrode formed on a side of the other surface of the semiconductor substrate. A connecting wire is partially extended outside the semiconductor substrate for electrically connecting the connecting pad and external electrode.
Claims12
A semiconductor package comprising:
- a semiconductor substrate including a device region on a first surface thereof, and a connecting pad electrically connected to the device region;
- a connecting wire which is formed on a side of the first surface of the semiconductor substrate and which includes a first end electrically connected to the connecting pad and a second end extending outside of the semiconductor substrate;
- an insulating film formed on the second surface of the semiconductor substrate and the connecting wire and having a hole at a position corresponding to the second end of the connecting wire;
- a support substrate formed on the side of the first surface of the semiconductor substrate so as to support the semiconductor substrate;
- an external electrode formed on the insulating film;
- and
- a distribution wire for electrically connecting the connecting wire and external electrode via the hole in the insulating film.
4 more elements
A semiconductor package comprising:
- a semiconductor substrate including a device region on a first surface thereof, and a connecting pad electrically connected to the device region;
- a support substrate formed on a side of the first surface of the semiconductor substrate;
- an external electrode formed on a side of a second surface of the semiconductor substrate;
- and
- connecting means, partially extended outside the semiconductor substrate, for electrically connecting the connecting pad and external electrode;
- wherein the connecting means includes a distribution wire extended to the side of the second surface of the semiconductor substrate, and a connecting wire formed on a surface of the support substrate opposing the semiconductor substrate, wherein the connecting wire comprises a first end portion connected to the connecting pad, and a second end portion extended outside the semiconductor substrate, and
- wherein a columnar electrode is formed on the second end portion of the connecting wire, and the distribution wire is connected to the columnar electrode.
4 more elements
Dependencies are inferred from the claim text.