Semiconductor package having light sensitive chips
AssigneeTessera, Inc.
InventorJoseph Fjelstad
Life of this patent
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Abstract
A microelectronic package including an optoelectronic element having a front face including contacts and a rear surface; flexible conductive leads having first ends connected to the contacts and second ends connected to conductive pads adjacent the optoelectronic element; and an at least partially transparent encapsulant covering the optoelectronic element, the flexible leads and the conductive pads, the conductive pads being exposed on a bottom surface of the encapsulant, the bottom surface of the encapsulant defining a bottom of the package, wherein the encapsulant at the bottom of the package extends between the conductive pads.
Claims19
A microelectronic package comprising:
- an optoelectronic element having a front face including contacts and a rear surface;
- conductive pads adjacent to the optoelectronic element, wherein the rear surface of the optoelectronic element does not overly the conductive pads;
- flexible conductive leads having first ends connected to the contacts and second ends connected to the conductive pads;
- a transparent encapsulant covering the optoelectronic element, the flexible leads and the conductive pads;
- a metal base attached to the rear surface of the optoelectronic element;
- and
- a transparent lid over the top surface of said encapsulant having an optical connector integrally formed therewith including a cavity adapted to receive an end of a light transmitting cable.
Dependencies are inferred from the claim text.