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AssigneeDainippon Ink and Chemicals, Inc.
InventorsEiju Ichinose, Yohzoh Yamashina, Hidenobu Ishikawa
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A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y). The polyimide resin is obtained by reacting a prepolymer (A) having an isocyanate group at the end, which is obtained by reacting a polyisocyanate compound (a1) with a polyol compound (a2) having a linear hydrocarbon structure in which a number-average molecular weight of a linear hydrocarbon structure is from 300 to 6,000, with an anhydride (B) of polycarboxylic acid having three or more carboxyl groups in an organic solvent.
A thermosetting polyimide resin composition comprising a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, a urethane bond, an imide ring, an isocyanurate ring, and a cyclic aliphatic structure, and an epoxy resin (Y).
A process for producing a polyimide resin, which comprises reacting a prepolymer having an isocyanate group at the end, which is obtained by reacting a polyisocyanate compound (a11) having an isocyanurate ring derived from an aliphatic polyisocyanate with a polyol compound (a2) having a linear hydrocarbon structure in which a number-average molecular weight of a linear hydrocarbon structure moiety is from 300 to 6,000, with an anhydride (B) of polycarboxylic acid having three or more carboxyl groups in an organic solvent.
A polyimide resin, which is obtained by reacting a prepolymer having an isocyanate group at the end, which is obtained by reacting a polyisocyanate compound having an isocyanurate ring derived from a cyclic aliphatic polyisocyanate with a polyols compound having a linear hydrocarbon structure in which a number-average molecular weight of a linear hydrocarbon structure moiety is from 700 to 4,500, with an anhydride (B) of polycarboxylic acid having three or more carboxyl groups in an organic solvent, wherein an acid value is from 20 to 250, the content of the linear hydrocarbon structure is from 20 to 40% by weight, a concentration of an isocyanurate ring is from 0.3 to 1.2 mmol/g, a number-average molecular weigh is from 2,000 to 30,000, and a weight average molecular weight is from 3,000 to 100,000.
A polyimide resin having a structure unit represented by the following general formula (1) and a structural unit represented by the following general formula (2) and also has one or more kinds of the end structures represented by the following general formulas (3), (4) and (5), wherein an acid value is from 20 to 250, the content of a linear hydrocarbon structure is from 20 to 40% by weight, a concentration of an isocyanurate ring is from 0.3 to 1.2 mmol/g, a number-average molecular weight is from 2,000 to 30,000, a weight-average molecular weight is from 3,000 to 100,000,
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