Process and manufacturing tool architecture for use in the manufacture of one or more protected metallization structures on a workpiece

A method of fabricating metal interconnect structures on a workpiece, comprising:

• applying a barrier layer to the workpiece in a first deposition station of a film deposition tool set;
• applying a copper seed layer to the barrier layer in a second deposition station of the film tool set;
• forming a patterned mask of a resist on the copper seed layer, the patterned mask having a plurality of openings defining locations form forming raised metal interconnect structures on the seed layer;
• plating copper onto the copper seed layer in the openings of the patterned mask in a first wet processing station of a wet tool set to form copper interconnect structures;
• removing the patterned mask in second wet processing station of the wet tool set;
• and
• removing portions of the seed layer between the copper interconnect structures in a third wet processing station of the wet tool set.