Method for fabricating semiconductor components with conductors having wire bondable metalization layers
AssigneeMicron Technology, Inc.
InventorWarren M. Farnworth
Life of this patent
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Abstract
A semiconductor component includes a semiconductor die, a low k polymer layer on the die and redistribution conductors on the polymer layer. The component also includes bonding pads on the conductors with a metal stack construction that includes a conductive layer, a barrier/adhesion layer and a non-oxidizing layer. The bonding pads facilitate wire bonding to the component and the formation of reliable wire bonds on the component. A method for fabricating the component includes the steps of forming the conductors and bonding pads using electroless deposition. The component can be used to fabricate electronic assemblies such as modules, packages and printed circuit boards.
Claims27
A method for fabricating a semiconductor component comprising:
- providing a semiconductor die comprising a die contact and at least one integrated circuit in electrical communication with the die contact;
- forming a polymer layer on the die;
- forming a redistribution conductor on the polymer layer in electrical communication with the die contact;
- forming a wire bonding pad on the conductor;
- forming a first metal layer on the conductor and the wire bonding pad;
- and
- forming a non-oxidizing metal layer on the first metal layer covering the first metal layer and edges thereof configured to seal and protect the conductor and the wire bonding pad and to provide a wire bondable surface.
A method for fabricating a semiconductor component comprising:
- providing a die comprising a plurality of integrated circuits, a circuit side, and a plurality of die contacts on the circuit side in electrical communication with the integrated circuits having a first pattern;
- forming a polymer layer on the circuit side;
- forming a plurality of conductors on the polymer layer in electrical communication with the die contacts;
- forming a plurality of wire bonding pads on the polymer layer in electrical communication with the conductors and having a second pattern;
- forming a plurality of barrier/adhesion layers on the conductors and the wire bonding pads;
- and
- forming a plurality of non-oxidizing layers on the barrier/adhesion layers and edges thereof configured to seal and protect the conductors and the wire bonding pads and to provide wire bondable surfaces.
A method for fabricating a semiconductor component comprising:
- providing a substrate comprising a semiconductor die comprising a plurality of integrated circuits and a plurality of die contacts in electrical communication with the integrated circuits;
- forming a plurality of metal bumps on the die contacts;
- forming a polymer layer on the die;
- planarizing the polymer layer and the metal bumps to a same surface;
- forming a plurality of conductors on the polymer layer in electrical communication with the metal bumps, the conductors comprising a plurality of wire bonding pads having a different pattern than the die contacts;
- forming barrier/adhesion layers on the conductors and the wire bonding pads;
- forming non-oxidizing layers on the barrier/adhesion layers and edges thereof configured to seal the conductors and the wire bonding pads and to provide wire bondable surfaces;
- and
- singulating the die from the substrate.
A method for fabricating a semiconductor component comprising:
- providing a semiconductor die including a circuit side, a plurality of integrated circuits, and a plurality of die contacts on the circuit side in electrical communication with the integrated circuits having a first pattern;
- forming a polymer layer on the circuit side;
- forming a plurality of conductors on the polymer layer in electrical communication with the die contacts;
- forming a plurality of wire bonding pads on the conductors having a second pattern;
- forming a plurality of barrier/adhesion layers on the conductors and the wire bonding pads;
- and
- forming a plurality of non-oxidizing layers covering the barrier/adhesion layers and edges thereof configured to provide wire bondable surfaces.
Dependencies are inferred from the claim text.