Method for the formation of diffusion barrier
AssigneeNovellus Systems, Inc.
InventorsSang-Hyeob Lee, Sasangan Ramanathan
Life of this patent
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Abstract
Electronic components such as semiconductor wafer VLSI and ULSI integrated circuit devices are provided having a robust barrier layer in the device interconnects. The robust barrier layer provides excellent step coverage, low resistance and enhanced adhesion to CVD copper and the interconnect has a double structure of a layer of a barrier material and a metal layer thereon. The metal layer is preferably tungsten and is formed by replacing silicon or other such atoms on the surface of the barrier layer with tungsten metal. A layer of silicon can be formed on the barrier layer, silicon atoms can be formed on the surface by reacting the barrier layer with a silicon containing reactant or a silicon containing barrier layer can be used.
Claims4
A method for making multilayer electronic component integrated circuit devices wherein interconnects in the devices have excellent step coverage, uniformity, low resistance and adhesion to CVD-copper comprising the steps of:
- forming a multilayer electronic component layer by layer with dielectric layers having openings therein with metallization formed in the openings to provide electrical connections between the layers;
- forming a diffusion barrier layer in the openings in the dielectric layer which diffusion barrier layer is a refractory material containing replaceable silicon atoms;
- forming a metal rich surface on top of the diffusion barrier layer by reacting the barrier layer with a metal containing reactant and replacing at least part of the replaceable atoms of the diffusion barrier layer with the metal of the metal containing reactant;
- and
- filling the openings in the dielectric layer with copper to provide a conductor which contacts the metallization in the dielectric layer to metallization in another layer.
Dependencies are inferred from the claim text.