Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement

A circuit arrangement comprising

• a first electrical contact structure on the integrated circuit,
• a corresponding second electrical contact structure on a substrate,
• the first electrical contact structure being in electrical communication with the second electrical contact structure,
• at least one of the first and second electrical contact structures having an elastic elevation thereon, and
• a frame structure attached to the integrated circuit and the substrate and being disposed to compress the elastic elevation, the frame structure including a lateral subregion at least partially surrounding the integrated circuit, the subregion including a region with individual discrete supports.

A circuit arrangement comprising

• a first electrical contact structure on the integrated circuit,
• a corresponding second electrical contact structure on a substrate,
• the first electrical contact structure being in electrical communication with the second electrical contact structure,
• at least one of the first and second electrical contact structures having an elastic elevation thereon,
• a frame structure attached to the integrated circuit and the substrate and being disposed to compress the elastic elevation;
• and
• a compression stop region on said integrated circuit.