Method for making an enhanced die-up ball grid array package with two substrates
AssigneeBroadcom Corporation
InventorsSam Ziqun Zhao, Reza-ur Rahman Khan, Imtiaz Chaudhry
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Abstract
An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
Claims50
A method of assembling a ball grid array (BGA) package, comprising the step of:
- (a) attaching a surface of a first substrate torn first surface of a stiffener, wherein the first substrate has a plurality of electrically conductive vias formed therethrough;
- (b) attaching a surface of a second substrate to a second surface of the stiffener, wherein the second substrate has a first opening formed therethrough, wherein the stiffener has a second opening formed therethrough;
- and
- (c) coupling at least one wire bond between an IC die and the first substrate through the first opening and the second opening.
A method of making a plurality of integrated circuit (IC) packages, comprising the steps of:
- (1) forming a stiffener strip that includes a plurality of stiffeners;
- (2) forming a first substrate ship that includes a plurality of first substrates;
- (3) forming a second substrate strip that includes a plurality of second substrates;
- (4) laminating the first substrate strip to a first surface of the stiffener strip;
- (5) laminating the second substrate strip to a second surface of the stiffener strip, whereby a substrate/stiffener/substrate strip combination is created;
- (6) mounting a plurality of IC dies to the substrate/stiffener/substrate strip combination;
- and
- (7) electrically coupling a bond pad of each IC die through the second substrate strip and the stiffener strip to a corresponding first substrate of the plurality of first substrates.
Dependencies are inferred from the claim text.