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US 6,887,740 B2Granted
Method for making an integrated circuit package having reduced bow
AssigneeMicron Technology, Inc.
InventorsWilliam D. Tandy, Matt E. Schwab, Cary J. Baerlocher
Life of this patent
Estimating the term…
Abstract
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.
Claims21
A method comprising:
- coupling a semiconductor device to a leadframe;
- overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second surface, and side surfaces, and the parting line is offset toward a second surface of the package;
- and
- forming at least one recess in the first surface of the package and reducing bow of the package.
1 more element
A method comprising:
- coupling a semiconductor device to a leadframe;
- overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second surface, and side surfaces, and the parting line is offset toward a second surface of the package;
- and
- wherein overmolding the package on at least a portion of the semiconductor device and forming the first surface includes forming a non-uniform planar surface and forming the second surface includes forming a uniform planar surface and reducing bow of the package.
1 more element
A method comprising:
- coupling a semiconductor device to a leadframe;
- overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first outer surface and a second outer surface, and side surfaces, and the parting line is offset toward second outer surface of the package;
- wherein the parting line and the first surface define a first portion of the package, the first portion having a first volume of material, the parting line and the second outer surface define a second portion of the package, the second portion having a second volume of material, and overmolding the package includes forming the first volume substantially the same as the second volume;
- and
- forming at least one recess in the first outer surface of the package.
2 more elements
A method comprising:
- coupling a semiconductor device to a leadframe;
- overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second outer surface, and side surfaces, and the parting line is offset toward the second surface of the package;
- wherein the parting line and the first surface define a first portion of the package, the first portion having a first volume of material, the parting line and the second surface define a second portion of the package, the second portion having a second volume of material, and overmolding the package includes forming the first volume substantially the same as the second volume;
- and
- forming at least one recessed area in the first surface of the package, and each recessed area extends partially from a first side surface of the package to a second side surface of the package.
2 more elements
A method comprising:
- coupling a semiconductor device to a leadframe;
- overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second outer surface, and side surfaces, and the parting line is offset toward the second surface of the package;
- wherein the parting line and the first surface define a first portion of the package, the first portion having a first volume of material, the parting line and the second surface define a second portion of the package, the second portion having a second volume of material, and overmolding the package includes forming the first volume substantially the same as the second volume;
- and
- forming at least one recessed area includes forming each recessed area with a border of material.
2 more elements
A method comprising:
- coupling a semiconductor device to a leadframe;
- overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second surface, and side surfaces, and the parting line is formed along the side surfaces and the parting line is offset toward a second surface of the package;
- forming a die area having a die area surface, wherein the first surface includes the die area surface, and the semiconductor device and at least one portion adjacent to the semiconductor device define the die area;
- recessing at least a first area defined by the first surface without the die area surface, wherein recessing the first area includes recessing the first area away from the die area surface;
- and
- reducing bow of the package.
3 more elements
A method comprising:
- coupling a semiconductor device to a leadframe;
- overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second surface, and side surfaces, and the parting line is formed along the side surfaces and the parting line is offset toward a second surface of the package;
- forming a die area having a die area surface, where the semiconductor device and at least one portion adjacent to the semiconductor device define the die area;
- recessing at least a first area defined by the first surface without the die area, wherein recessing the first area includes recessing the first area away from the die area surface;
- and
- wherein the package has a first side surface and a second side surface opposite one another and defining a first length therebetween, and the package has a third side surface and a fourth side surface defining a second length therebetween, and overmolding the package includes forming the first length greater than the second length, and forming each recessed area to extend fully from the third side surface of the package to the fourth side surface of the package.
3 more elements
A method comprising:
- coupling a semiconductor device to a leadframe;
- overmolding a package on at least a portion of the semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second surface, and side surfaces, and the parting line is formed along the side surfaces and the parting line is offset toward a second surface of the package;
- forming a die area having a die area surface, where the semiconductor device and at least one portion adjacent to the semiconductor device define the die area;
- recessing at least a first area defined by the first surface without the die area, wherein recessing the first area includes recessing the first area away from the die area surface;
- and
- wherein the package has a first side surface and a second side surface opposite one another and defining a first length therebetween, and the package has a third side surface and a fourth side surface defining a second length therebetween, and overmolding the package includes forming the first length greater than the second length, and forming each recessed area to extend filly from the first side surface of the package to the second side surface of the package.
3 more elements
A method comprising:
- coupling at least one semiconductor device to a leadframe;
- overmolding a package on at least a portion of the at least one semiconductor device and over a portion of the leadframe and forming a parting line, where the package has a first surface and a second surface, and side surfaces, and the parting line is offset toward a second surface of the package;
- wherein the parting line and the first surface define a first portion of the package, the first portion having a first volume of material, the parting line and the second surface define a second portion of the package, the second portion having a second volume of material, and overmolding the package includes forming the first volume the substantially the same as the second volume;
- and
- forming at least one recess in the first surface of the package.
2 more elements
Dependencies are inferred from the claim text.