Method of making semiconductor device with flip chip mounting
AssigneeSharp Kabushiki Kaisha
InventorSusumu Shintani
Life of this patent
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Abstract
A semiconductor device is arranged such that a semiconductor chip having electrodes is flip chip mounted on printed substrate pads on a printed wiring substrate by a bump formed on each electrode. The semiconductor chip and the printed wiring substrate are fixed with a thermo-setting resin. A penetration hole is formed within an area where the printed substrate pad contacts each gold bump, and the gold bump has a joint section also on a side face of the penetration hole of the printed substrate pad. With this structure, the semiconductor device has a secure electrical connection between the bump and the metal pattern.
Claims16
A method for manufacturing a semiconductor device comprising conducting flip chip mounting by pressing a semiconductor chip including a bump onto a wiring pattern formed on a substrate, said method for manufacturing a semiconductor device further comprising:
- i) forming the wiring pattern which includes a stepped section on the substrate;
- and
- ii) joining said bump to both the wiring pattern and the substrate so as to cover an outside of the wiring pattern, so as to join said bump to both (a) at least one side face of the stepped section of the wiring pattern and (b) a portion of the substrate outside of the outer periphery of the wiring pattern to which the bump is joined.
A method for manufacturing a semiconductor device, the method comprising:
- conducting flip chip mounting by pressing a semiconductor chip including a bump on an electrode, onto a metal pattern formed on a substrate;
- and
- fixing said semiconductor chip and said substrate with a resin,
- the method for manufacturing a semiconductor device further comprising:
- joining said bump to both the metal pattern and the substrate so as to cover an outside periphery of the wiring pattern, so as to form a stepped section of the metal pattern joined to the bump, and so as to join said bump also to at least one outside face of the stepped section of the wiring pattern.
Dependencies are inferred from the claim text.