Transfer method, method of manufacturing thin film devices, method of manufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, ic card, and electronic appliance

A transfer method for transferring a transferred body, comprising:

• forming a transfer layer on a transfer origin substrate;
• forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device;
• applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred;
• and
• transferring said transferred bodies corresponding to the partial regions onto transfer destination substrates;
• the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other said transferred bodies corresponding to the other partial regions onto other said transfer destination substrates.

A transfer method for transferring transferred bodies, comprising:

• forming a transfer layer on a transfer origin substrate;
• forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device;
• transferring said transferred bodies from said transfer origin substrate onto an intermediate transfer substrate;
• and
• transferring said transferred bodies from said intermediate transfer substrate onto a transfer destination substrate;
• at least either the transferring of said transferred bodies onto said intermediate transfer substrate or the transferring of said transferred bodies onto said transfer destination substrate, comprising applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred, and transferring said transferred bodies formed in the partial regions.

A transfer method for transferring transferred bodies, comprising:

• forming a transfer layer on a transfer origin substrate;
• forming a plurality of transferred bodies on the transfer layer, each of the plurality of transferred bodies including a circuit device;
• transferring said transferred bodies from said transfer origin substrate onto an intermediate transfer substrate;
• and
• transferring said transferred bodies from said intermediate transfer substrate onto transfer destination substrates;
• at least either the transferring of said transferred bodies onto said intermediate transfer substrate or the transferring of said transferred bodies onto said transfer destination substrates, comprising applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred, and transferring said transferred bodies formed in the partial regions;
• and
• the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other transferred bodies corresponding to the other partial regions onto another one of said transfer destination substrates.

A transfer method for transferring a transferred body, comprising:

• forming a transfer layer on a transfer origin substrate;
• forming a plurality of transferred bodies by patterning the transfer layer on the transfer origin substrate;
• applying energy to a partial region of the transfer layer corresponding to each of said transferred bodies to be transferred;
• and
• transferring said transferred bodies corresponding to the partial region onto a transfer destination substrate.

A transfer method for transferring a transferred body, comprising:

• forming a transfer layer on a transfer origin substrate;
• forming a plurality of transferred bodies by patterning the transfer layer on the transfer origin substrate;
• and
• applying energy to partial regions of the transfer layer corresponding to said transferred bodies to be transferred;
• and
• transferring said transferred bodies corresponding to the partial regions onto transfer destination substrates;
• the transferring onto said transfer destination substrates comprising, after transferring said transferred bodies onto one of said transfer destination substrates, repeating the applying of energy to other partial regions corresponding to other said transferred bodies on said transfer origin substrate, and transferring said other said transferred bodies corresponding to the other partial regions onto other said transfer destination substrates.