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US 6,887,580 B2Granted
Adhesive polyimide resin and adhesive laminate
AssigneeNippon Steel Chemical Co., Ltd.
InventorsKiwamu Tokuhisa, Akira Tokumitsu, Kazuaki Kaneko
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AssigneeNippon Steel Chemical Co., Ltd.
InventorsKiwamu Tokuhisa, Akira Tokumitsu, Kazuaki Kaneko
Estimating the term…
An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250□C and a Young's modulus (storage modulus) at 250□C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270□C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.
An adhesive polyimide resin comprising a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a crosslinkable reactive group and (B2) a siloxanediamine, said crosslinkable reactive group being a phenolic hydroxyl group, a carboxyl group or a vinyl group, and said adhesive polyimide resin having a glass transition temperature of from 50 to 250° C. and a Young's modulus (storage modulus) at 250° C. of 105 Pa or more.
A laminate which comprises a substrate having formed thereon a conductor, at least one layer of an insulating supporting layer and an adhesive polyimide resin layer, said insulating supporting layer having an average thermal expansion coefficient of 30×10−6 or less, and said adhesive polyimide resin layer comprising a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a crosslinkable reactive group and (B2) a siloxanediamine, and said adhesive polyimide resin layer having a glass transition temperature of from 50 to 250° and a Young's modulus (storage modulus) at 250° C. of 105 Pa or more.
A polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a crosslinkable reactive group and (B2) a siloxanediamine, said crosslinkable reactive group being a phenolic hydroxyl group, a carboxyl group or a vinyl group, and said polyimide resin having a glass transition temperature of from 50 to 250° C. and a Young's modulus (storage modulus) at 250° C. of 105 Pa or higher.
A laminate which comprises a substrate having formed thereon a conductor, at least one layer of an insulating supporting layer and an adhesive polyimide resin layer, said insulating supporting layer having an average thermal expansion coefficient of 30×10−6 or less, and said adhesive polyimide resin layer comprising a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a crosslinkable reactive group and (B2) a siloxanediamine, said crosslinkable reactive group being a phenolic hydroxyl group, a carboxyl group or a vinyl group, and said adhesive polyimide resin layer having a glass transition temperature of from 50 to 250° C. and a Young's modulus (storage modulus) at 250° C. of 105 Pa or more.
Dependencies are inferred from the claim text.