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US 6,887,525 B2Granted
Insulation material for use in high-frequency electronic parts
Assignee3M Innovative Properties Company
InventorsMitsuaki Kobayashi, Hiroshi Ayukawa
Life of this patent
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Abstract
To provide an insulating material that has low dielectric constant and low dielectric loss tangent, and is superior in its processability into thin film. An insulating material for use in high-frequency electronic parts comprising: a matrix component composed at polyimide, and fluorocarbon resin particles uniformly dispersed therein.
Claims6
An insulating material for use in high-frequency electronic parts comprising:
- a matrix component composed of polyimide, and fluorocarbon resin particles uniformly dispersed therein, wherein said polyimide comprises a 9,9-bis(aminoaryl)fluorene as a diamine component.
A method of preparing an insulating material for use in high-frequency electronic parts comprising the steps of:
- preparing a polyimide solution by dissolving soluble polyimide in a volatile organic solvent;
- preparing a fluorocarbon resin dispersed polyimide solution by adding fluorocarbon resin particles to the polyimide solution so as to be uniformly dispersed;
- applying the fluorocarbon resin dispersed polyimide solution the a substrate;
- and
- drying the resulting product.
2 more elements
Dependencies are inferred from the claim text.