Method for fabricating printed-wiring substrate

A method for fabricating a component board including a printed-wiring substrate having a substantially plate-like shape, a main face and a back face, and comprising main-face-side connection terminals solder-bonded to connection terminals of an electronic component which is to be mounted on the main face;

• and back-face-side connection terminals connected, through mechanical contact, to connection terminals of another substrate which is to be connected to the printed-wiring substrate on the back-face side thereof, the method comprising:
• forming a first main-face-side Au plating layer on the surfaces of the main-face-side connection terminals and a first back-face-side Au plating layer on the surfaces of the back-face-side connection terminals;
• covering the first main-face-side Au plating layer with a protection layer;
• removing the first back-face-side Au plating layer after completing the masking step;
• forming a second back-face-side Au plating layer directly on the surfaces of the back-face-side connection terminals, from which the first back-face-side Au plating layer has been removed, to a thickness greater than that of the first main-face-side Au plating layer;
• and
• removing the protection layer after completing the second Au plating step, wherein
• the first Au plating comprising first displacement Au plating, and
• the second Au plating comprising second displacement Au plating.