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US 6,887,336 B2Granted
Method for fabricating a CMP pad having isolated pockets of continuous porosity
AssigneeMicron Technology, Inc.
InventorSteve Kramer
Life of this patent
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Abstract
A method for fabricating a chemical mechanical polishing pad and a system and a method for using such a pad are described. The method comprises providing a continuously porous pad and forming non-porous regions on the pad in a pattern which segregates a pluarlity of porous regions from one another, wherein each of the porous regions includes a plurality of interconnected pores. The non-porous matrix may include a network of trenches, or may have pores which have been filled with a material. The material may include a polymer resin.
Claims11
A method for fabricating a chemical mechanical polishing pad, comprising:
- providing a continuously porous pad;
- and
- forming non-porous regions on the pad in a pattern which segregates a plurality of porous regions from one another, wherein each of said porous regions includes a plurality of interconnected pores.
Dependencies are inferred from the claim text.