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US 6,887,133 B1Granted
Pad support method for chemical mechanical planarization
AssigneeStrasbaugh
InventorDavid G. Halley
Life of this patent
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Abstract
Embodiments of the invention as directed to supporting a polishing pad that can be easily replaced. In one embodiment, a method for polishing an object comprises coupling a polishing head to a substrate for holding a polishing pad which is smaller in area than the object; applying a resilient mechanical force to the perimeter of the substrate with the polishing head to hold the substrate in place during a polishing operation; placing the polishing pad in contact with the object; and rotating the polishing pad with the polishing head.
Claims9
A method for polishing an object, the method comprising:
- coupling a polishing head to a substrate for supporting a polishing pad which is smaller in area than the object;
- applying a resilient mechanical force to the perimeter of the substrate with the polishing head to hold the substrate in place during a polishing operation;
- supporting the polishing pad by the substrate;
- placing the polishing pad in contact with the object;
- and
- rotating the polishing pad with the polishing head.
3 more elements
Dependencies are inferred from the claim text.