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AssigneeMulti-Planar Technologies, Inc.
InventorsJiro Kajiwara, Gerard Moloney, Jun Liu, Junsheng Yang, Ernesto Saldana, Cormac Walsh, Alejandro Reyes
Estimating the term…
A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield. Optionally, the apparatus (100) further includes a dispenser (186) for dispensing a cleaning fluid before and/or after the wiper (180) to substantially eliminate buildup of deposits.
A polishing apparatus for removing material from a surface of a substrate, the polishing apparatus comprising:
A polishing apparatus for removing material from a surface of a substrate, the polishing apparatus comprising:
A method of polishing a substrate having a surface using a polishing apparatus having a polishing surface and a polishing head adapted to hold the substrate during a polishing operation, the method comprising steps of:
Dependencies are inferred from the claim text.