Chemical mechanical polishing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsJong-Won Lee, Chang-Ki Hong, Ho-Young Kim
Life of this patent
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Abstract
A chemical mechanical polishing (CMP) apparatus includes a plate that holds a substrate, a pad assembly unit comprising a pad support device, a positioning device, and a rotation device operatively connected to the pad assembly unit. The pad support device comprises a plurality of support plates to which pad pieces of a polishing pad can be attached. The positioning device can move at least one of the plurality of support plates in a direction along a surface of the semiconductor substrate to be polished. Further, the CMP apparatus can control the polishing amount along any portion of a surface of a wafer to be polished.
Claims24
A chemical mechanical polishing (CMP) apparatus, comprising:
- a plate that holds a substrate;
- a polishing pad including pad pieces, wherein the polishing pad has a circular shape, a triangular shape, a quadrangular shape, or an elliptical shape;
- a pad assembly unit comprising a pad support device and a positioning device, wherein the pad support device comprises a plurality of support plates to which the pad pieces of the polishing pad can be attached, and wherein the positioning device can move at least one of the plurality of support plates in a direction along a surface of a substrate to be polished;
- and a rotation device operatively connected to the pad assembly unit.
A chemical mechanical polishing (CMP) apparatus, comprising:
- a plate that holds a substrate;
- a pad assembly unit comprising a pad support device and a positioning device, wherein the pad support device comprises a plurality of support plates to which pad pieces of a polishing pad can be attached, and wherein the positioning device can move at least one of the plurality of support plates in a direction along a surface of a substrate to be polished;
- and a rotation device operatively connected to the pad assembly unit,
- wherein the plurality of support plates include a fixed support plate and a plurality of movable support plates disposed around the fixed support plate.
A chemical mechanical polishing (CMP) apparatus, comprising:
- a plate that holds a substrate;
- a pad assembly unit comprising a pad support device and a positioning device, wherein the pad support device comprises a plurality of support plates to which pad pieces of a polishing pad can be attached, and wherein the positioning device comprises a housing, a plurality of motors attached to the housing, a plurality of screws rotatably attached to the housing, and wherein each screw is coupled to a corresponding motor, and a plurality of connecting rods each having a screw groove, wherein each connecting rod is coupled to a corresponding support plate and to a corresponding screw through the screw groove;
- and
- a rotation device operatively connected to the pad assembly unit.
A pad assembly unit for a chemical mechanical polishing (CMP) apparatus, the pad assembly unit comprising:
- a pad support device comprising a plurality of support plates to which pad pieces of a polishing pad can be attached;
- and
- a positioning device that can move at least one of the plurality of support plates in a direction along a surface of a substrate to be polished, wherein the plurality of support plates include a fixed support plate and a plurality of movable support plates.
Dependencies are inferred from the claim text.