Chemical mechanical polishing with friction-based control
AssigneeApplied Materials, Inc.
InventorsManoocher Birang, Shijian Li
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Abstract
A chemical mechanical polishing apparatus has a polishing surface, a carrier head to press a substrate against the polishing surface with a controllable pressure, a motor to generate relative motion between the polishing surface and the carrier head at a velocity, and a controller. The controller is configured to vary at least one of the pressure and velocity in response to a signal that depends on the friction between the substrate and the polishing surface to maintain a constant torque, frictional force, or coefficient of friction.
Claims24
A method of chemical mechanical polishing, comprising:
- pressing a substrate against a polishing surface with a controllable pressure;
- creating relative motion between the polishing surface and the substrate at a velocity;
- and
- controlling at least one of the pressure and velocity in response to a signal that depends on the friction between the substrate and the polishing surface to maintain a constant torque, frictional force, or coefficient of friction.
A method of chemical mechanical polishing, comprising:
- pressing a substrate against a polishing surface with a controllable pressure applied by a carrier head;
- creating relative motion between the polishing surface and the substrate at a velocity;
- and
- controlling the pressure applied by the carrier head in response to a friction between the substrate and the polishing surface to maintain a substantially constant polishing rate.
Dependencies are inferred from the claim text.