Method of thermosonic wire bonding process for copper connection in a chip
AssigneeNational Chung Cheng University
InventorsYeau-Ren Jeng, Chang-Ming Wang
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Abstract
A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness of the film is in the range of 8050 Å to 8200 Å. Therefore, this invention provides the thermosonic wire bonding process for improvement of efficiency and quality.
Claims2
A method of thermosonic wire bonding process for copper connection in a chip by generating a copper oxide film in an artificial circumstance, the thickness of said oxide film being in the range of 8050 Å to 8200 Å, which is used for bonding.
Dependencies are inferred from the claim text.