Elastomeric heat sink with a pressure sensitive adhesive backing
AssigneeCool Options, Inc.
InventorsE. Mikhail Sagal, Jeffrey Panek, Kevin A. McCullough
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AssigneeCool Options, Inc.
InventorsE. Mikhail Sagal, Jeffrey Panek, Kevin A. McCullough
Estimating the term…
The present invention discloses a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties. In addition, the present invention provides a method of manufacturing an elastomeric heat sink device as described above.
A heat dissipating device, comprising:
A heat dissipating assembly, comprising:
Dependencies are inferred from the claim text.