Brush pressure calibration apparatus and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChing-Long Lin, Yung-Hsiang Hu, Fu-Tao Ho
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChing-Long Lin, Yung-Hsiang Hu, Fu-Tao Ho
Estimating the term…
A novel apparatus and method for calibrating the gap distance between adjacent scrubber brushes with the frictional force of the brushes against a wafer, is disclosed. The apparatus includes a support frame, at least one pair of load cells carried by the support frame, at least one test plate operably engaging the load cells, and at least one electronic indicator operably connected to the load cells, respectively, for indicating a force exerted on the load cells by the test plate. The method includes placing at least one test plate between the adjacent scrubber brushes, rotating the scrubber brushes against the test plate, determining the frictional force of each brush against the plate, and adjusting the gap distance between the brushes to obtain a desired frictional force for the scrubber cleaning of production wafers.
A brush pressure calibration apparatus for correlating a gap distance between scrubber brushes with a frictional force of the scrubber brushes, comprising:
A method of correlating a frictional force of a pair of scrubber brushes with a gap distance between the brushes, comprising the steps of:
A method of correlating frictional forces between a pair of scrubber brushes with a gap distance between the brushes and determining a degree of parallelism between the brushes, comprising the steps of:
Dependencies are inferred from the claim text.