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US 6,886,248 B2Granted
Conductive material and method for filling via-hole
AssigneeFujitsu Limited
InventorsIsao Watanabe, Kaoru Hashimoto, Osamu Taniguchi
Life of this patent
Estimating the term…
Abstract
The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.
Claims7
A method for filling a via-hole comprising the steps of:
- in an equipment having a first pressure, supplying a conductive material to a substrate with a via-hole formed in to bury the conductive material in an upper end part of the via-hole;
- and
- changing the pressure in the equipment to a second pressure which is higher than the first pressure to thereby draw the conductive material buried in the upper end part of the via-hole into the via-hole.
Dependencies are inferred from the claim text.