Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
Assignee3M Innovative Properties Company
InventorsSusrut Kesari, William M. Lamanna, Michael J. Parent, Lawrence A. Zazzera
Life of this patent
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Abstract
The present invention provides methods of polishing and/or cleaning copper interconnects using bis(perfluoroalkanesulfonyl) imide acids or copper tris(perfluoroalkanesulfonyl) methide acids compositions.
Claims58
A method of polishing a copper interconnect and/or film comprising the steps of:
- a) providing a composition comprising:
- i) at least one weight percent of at least one bis(perfluoroalkanesulfonyl) imide acid represented by the formula:
- wherein each Rf is independently a perfluorinated alkyl group comprising 1 to 12 carbon atoms that may be cyclic or acyclic, may optionally contain catenated or terminal heteroatoms selected from the group consisting of N, O, and S, and any two Rf groups may be linked to form a perfluoroalkylene-containing ring;
- and
- ii) solvent;
- b) providing a substrate comprising at least one surface having at least one copper interconnect and/or film;
- c) bringing the surface of the substrate and the composition into contact with each other to form an interface;
- and
- d) applying a force to promote copper dissolution at the interface.
A method of polishing a copper interconnect and/or film comprising the steps of:
- a) providing a composition comprising:
- i) at least one tris(perfluoroalkanesulfonyl) methide acid represented by the formula:
- wherein each Rf is independently a perfluorinated alkyl group comprising 1 to 8 carbon atoms that may be cyclic or acyclic, may optionally contain catenated or terminal heteroatoms selected from the group consisting of N, O, and S, and any two Rf groups may be linked to form a perfluoroalkylene-containing ring;
- and
- ii) solvent;
- b) providing a substrate comprising at least one surface having at least one copper interconnect and/or film;
- c) bringing the surface of the substrate and the composition into contact with each other to form an interface;
- and
- d) applying a force to promote copper dissolution at the interface.
A method of cleaning a copper interconnect and/or film comprising the steps of:
- a) providing a composition comprising:
- i) at least one weight percent of at least one bis(perfluoroalkanesulfonyl) imide acid represented by the formula
- wherein each Rf is independently a perfluorinated alkyl group comprising 1 to 12 carbon atoms that may be cyclic or acyclic, may optionally contain catenated or terminal heteroatoms selected from the group consisting of N, O, and S, and any two Rf groups may be linked to form a perfluoroalkylene-containing ring;
- and
- ii) solvent;
- b) providing a substrate comprising at least one surface having at least one copper interconnect and/or film, the copper interconnect and/or film having at least one unwanted material on the surface;
- c) bringing the surface of the substrate and the composition into contact with each other to form an interface;
- and
- d) allowing removal of unwanted surface material.
A method of cleaning copper interconnects and/or film comprising the steps of:
- a) providing a composition comprising:
- i) at least one tris(perfluoroalkanesulfonyl) methide acid represented by the formula
- wherein each Rf is independently a perfluorinated alkyl group comprising 1 to 8 carbon atoms that may be cyclic or acyclic, may optionally contain catenated or terminal heteroatoms selected from the group consisting of N, O, and S, and any two Rf groups may be linked to form a perfluoroalkylene-containing ring;
- and
- ii) solvent;
- b) providing a substrate comprising at least one surface having at least one copper interconnect and/or film, the copper interconnect and/or film having at least one unwanted material on the surface;
- c) bringing the surface of the substrate and the composition into contact with each other to form an interface;
- and
- d) allowing removal of unwanted surface material.
A method of electrochemical mechanical deposition comprising the steps of:
- a) providing a composition comprising:
- i) at least one weight percent of at least one bis(perfluoroalkanesulfonyl) imide acid represented by the formula
- wherein each Rf is independently a perfluorinated alkyl group comprising 1 to 12 carbon atoms that may be cyclic or acyclic, may optionally contain catenated or terminal heteroatoms selected from the group consisting of N, O, and S, and any two Rf groups may be linked to form a perfluoroalkylene-containing ring;
- ii) solvent;
- and
- iii) copper salt;
- b) providing a conductive substrate;
- c) bringing the conductive substrate and the composition into contact with each other;
- and
- d) applying an electrochemical potential and a force to promote copper deposition and copper polishing.
A method of electrochemical mechanical deposition comprising the steps of:
- a) providing a composition comprising:
- i) at least one tris(perfluoroalkanesulfonyl) methide acid represented by the formula:
- wherein each Rf is independently a perfluorinated alkyl group comprising 1 to 8 carbon atoms that may be cyclic or acyclic, may optionally contain catenated or terminal heteroatoms selected from the group consisting of N, O, and S, and any two Rf groups may be linked to form a perfluoroalkylene-containing ring;
- ii) solvent;
- and
- iii) copper salt;
- b) providing a conductive substrate;
- c) bringing the conductive substrate and the composition into contact with each other;
- and
- d) applying an electrochemical potential and a force to promote copper deposition and copper polishing.
A composition comprising:
- a) at least one weight percent of at least one bis(perfluoroalkanesulfonyl) imide acid represented by the formula
- wherein each Rf is independently a perfluorinated alkyl group comprising 1 to 12 carbon atoms that may be cyclic or acyclic, may optionally contain catenated or terminal heteroatoms selected from the group consisting of N, O, and S, and any two Rf groups may be linked to form a perfluoroalkylene containing ring;
- b) solvent;
- and
- c) oxidizing agent.
A composition comprising:
- a) at least one tris(perfluoroalkanesulfonyl) methide acid represented by the formula:
- wherein each Rf is independently a perfluorinated alkyl group comprising 1 to 8 carbon atoms that may be cyclic or acyclic, may optionally contain catenated or terminal heteroatoms selected from the group consisting of N, O, and S, and any two Rf groups may be linked to form a perfluoroalkylene-containing ring;
- b) solvent;
- and
- c) oxidizing agent.
Dependencies are inferred from the claim text.