Multi-layer polishing pad material for CMP
AssigneeCabot Microelectronics Corporation
InventorsAbaneshwar Prasad, Roland K. Sevilla, Michael S. Lacy
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Abstract
The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the polishing layer and bottom layer are joined together without the use of an adhesive. The invention is also directed to a polishing pad comprising an optically transmissive multi-layer polishing pad material, wherein the layers of the polishing pad material are joined together without the use of an adhesive.
Claims38
A multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, wherein the polishing layer and the bottom layer are joined together without the use of an adhesive, and wherein (i) the polishing layer is porous and the bottom layer is non-porous or (ii) the polishing layer is non-porous and the bottom layer is porous.
A multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer, a bottom layer, and one or more middle layers disposed between the polishing layer and the bottom layer, wherein (i) the polishing layer, the bottom layer, and the middle layer or layers are substantially coextensive, (ii) the polishing layer, middle layer or layers, and the bottom layer are joined together without the use of any adhesive, and (iii) the polishing layer and the bottom layer are porous and the middle layer or layers are non-porous.
A polishing pad for chemical-mechanical polishing comprising an optically transmissive multi-layer polishing pad material, wherein (i) the optically transmissive polishing pad material comprises a first transmissive layer and a second transmissive layer that are joined together without the use of an adhesive and (ii) the first transmissive layer is porous and the second transmissive layer is non-porous.
Dependencies are inferred from the claim text.