Apparatus for electrochemical processing
AssigneeApplied Materials, Inc.
InventorsAntoine P. Manens, Paul D. Butterfield
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Abstract
A method and apparatus for electrically biasing a substrate in an electrochemical processing system is generally provided. In one embodiment, an apparatus for electrochemical processing includes a polishing pad and a conductive element disposed therein. The polishing pad has an upper surface adapted to support a substrate thereon during processing. The conductive element disposed in the polishing pad is movable between a first position having at least a portion of the conductive element exposed above the upper surface and a second position below the upper surface, wherein the conductive element is magnetically biased towards the first position.
Claims37
A polishing apparatus, comprising:
- a polishing surface;
- a plurality of conductive elements movably disposed through the polishing surface;
- and
- a polishing head adapted to retain a substrate against the polishing surface while processing, wherein the polishing head and the conductive elements are magnetically coupled.
A polishing apparatus, comprising:
- a polishing pad having an upper surface adapted to support a substrate thereon during processing;
- and
- a conductive element disposed in the polishing pad and movable between a first position having at least a portion of the conductive element exposed above the upper surface and a second position below the upper surface, wherein the conductive element is magnetically biased towards the first position.
A polishing apparatus, comprising:
- a polishing surface;
- a platen supporting the polishing surface;
- at least one conductive element movable between a first position below the polishing surface and a second position at least partially exposed above the polishing surface;
- and
- a magnetic element magnetically coupled to the conductive element, wherein the magnetic element urges the conductive element between at least one of the first and second positions.
A method for removing conductive material from a substrate, comprising:
- retaining a substrate in a polishing head against a polishing surface;
- magnetically biasing a conductive element against the substrate;
- flowing electrolyte to the substrate;
- and
- electrically biasing the conductive element.
A method for removing conductive material from a substrate, comprising:
- retaining a substrate in a polishing head against a polishing surface;
- applying power to an electromagnet disposed in the polishing head;
- magnetically attracting a conductive element disposed in the polishing substrate to the electromagnet;
- and
- electrically biasing the conductive element.
A polishing apparatus, comprising:
- a polishing pad having an upper surface adapted to support a substrate thereon during processing;
- and
- a conductive element disposed in the polishing pad and movable between a first position proximate the upper surface and a second position away from the upper surface, wherein the conductive element is magnetically biased towards the first position.
A polishing apparatus comprising:
- a polishing pad having an upper surface adapted to support a substrate thereon during processing;
- and
- a conductive element movably disposed in the polishing pad and magnetically biased towards the upper surface.
A method for removing conductive material from a substrate, comprising:
- positioning the substrate on a polishing pad having an electrolyte disposed thereon;
- magnetically biasing one or more conductive elements movably disposed in the pad into contact with the substrate;
- and
- applying a current to the substrate through the conductive elements.
Dependencies are inferred from the claim text.