Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces

An end effector for conditioning a polishing pad used in polishing a micro-device workpiece, the end effector comprising:

• a plate including a first surface, a second surface opposite the first surface, a plurality of apertures extending from the first surface to the second surface, and fluid fittings at the apertures through which a conditioning solution can flow;
• and
• a plurality of rigid contact elements projecting from the first surface;
• wherein the apertures comprises a plurality of first apertures in a first region of the plate and a plurality of second apertures in a second region of the plate, wherein the plurality of first apertures is configured to provide a first volume of conditioning solution to the polishing pad, and wherein the plurality of second apertures is configured to provide a second volume of conditioning solution to the polishing pad, the second volume being different than the first volume.

An apparatus for conditioning a polishing pad used in polishing micro-device workpieces, the apparatus comprising:

• a table having a support surface;
• a polishing pad coupled to the support surface of the table;
• a source of conditioning solution;
• and
• a conditioner including an end effector and a drive system coupled to the end effector, the end effector having a first surface, a plurality of apertures configured to flow a conditioning solution to the polishing pad, and a plurality of rigid contact elements from the first surface, wherein the apertures are operatively coupled to the source of conditioning solution wherein the apertures comprises a plurality of first apertures in a first region of the first surface, and a plurality of second apertures in a second region of the first surface, wherein the first apertures are configured to provide a first volume of conditioning solution to the polishing pad, wherein the second apertures are configured to provide a second volume of conditioning solution to the polishing pad, the second volume being different than the first volume, and wherein the conditioner and/or the table is movable relative to the other to rub the contact elements against the polishing pad.