Socket with multiple contact pad area socket contacts

A system, comprising:

• a system substrate;
• a bus disposed on the system substrate to facilitate data exchange;
• a socket coupled to the system substrate, the socket including:
• a body;
• a socket contact housed by the body, the socket contact including
• a first end configured to interconnect with a load generating device;
• and
• a second end, the second end having a contact pad configured to enable placement of an electronic component between the socket contact and a substrate and electrical coupling of the electronic component between the socket contact and the bus;
• wherein the contact pad includes a first contact pad area that is curvilinear and a second contact pad area that is rectilinear.

A socket connection, comprising:

• a substrate;
• an electronic component, the electronic component electrically coupled to the substrate;
• and
• a socket body, the socket body including a plurality of socket contacts, each of the socket contacts including
• a first end configured to electrically couple with a load generating device, and
• a second end, the second end having a contact pad configured to enable placement of the electronic component between the contact second end and the substrate and electrical coupling of the electronic component between the socket contact and a bus disposed on the substrate.