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US 6,883,698 B1Granted
Planting device for planting solder balls onto a chip
AssigneeHigh Tech Computer, Corp.
InventorChun-Wei Yang
Life of this patent
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Abstract
A planting device for planting solder balls onto a chip includes a main board with a plurality of apertures for accommodating solder balls, and a fixture for fixing the chip under the main board. The chip is coated with a layer of adhesive for adhering the solder balls accommodated inside the apertures onto the chip.
Claims12
A planting device for planting solder balls onto a chip comprising:
- a main board installed with a plurality of apertures, each aperture for accommodating one solder ball;
- a fixture for fixing the chip under the main board;
- a solder ball carrier for carrying solder balls, the main board being disposed on an end of the carrier and capable of accommodating the solder balls sliding from the solder ball carrier with the plurality of apertures when the carrier is shaking;
- a supporting frame for supporting the solder ball carrier;
- a connecting device fixed to an end of the supporting frame;
- and
- a lever plate having a first end and a second end, the first end of the lever plate rotatably connecting to the connecting device, the lever plate installed with a chip base for placing the chip therein and for positioning the chip, so that the chin can be accurately positioned inside the fixture when the second end of the lever plate is raised to a height so that the lever plate is adjacent to the solder ball carrier;
- wherein the chip is coated with a layer of adhesive for adhering the solder balls accommodated inside the apertures onto the chip.
5 more elements
Dependencies are inferred from the claim text.