US 6,883,592 B2 · Heatsink for electronic component

Abstract

A heatsink for dissipating heat from a heat-generating source such as an electronic component includes heatsink plates, wherein the individual heatsink plates are bound together at a binding portion to form a heat-absorbing portion for contacting a heat-dissipating surface of the electronic component, and portions of the heatsink plates opposite the heat-absorbing surface are separated from each other to collectively act as a heat-dissipating portion binding the heatsink plates together. To provide the separation between heat-dissipating portions of the heatsink plates, the heatsink includes spacers interposed between the binding portions of neighboring heatsink plates or the heatsink plates are spread out apart from each other by being bent at angles. The heatsink plates include fins spaced apart from each other at an interval. The binding element is preferably a rivet. In manufacturing the heatsink, a protrusion is formed at the individual heatsink plates such that the heat dissipating portion of the heatsink is unfolded outward at a angle by the protrusion. The heatsink can transfer the heat generated from a heat-generating source into the surrounding air, without power consumption and without generation of noise and vibrations, and such a heatsink can easily be manufactured.

Claims15

Dependent claims

A heatsink for an electronic component comprising:

a plurality of heatsink plates, each of the heatsink plates having a binding portion and a heat-dissipating portion, each heat-dissipating portion including a plurality of heat-dissipating fins joined to the binding portion, wherein the heatsink plates are bound together at the binding portions to form a heat-absorbing portion for contacting a heat-dissipating surface of an electronic component, and at least some of the heat-dissipating portions of the heatsink plates are bent at respective angles relative to the respective binding portions of the heatsink plates to increase separation between adjacent heat-dissipating portions;
and
means for binding the plurality of heatsink plates together, wherein
the plurality of heat-dissipating fins on each heat-dissipating portion are grouped into at least two groups of fins and the groups are separated from each other for mounting of the heatsink on an electronic component with a clip fitting on the electronic component between the groups of the fins, and
each heat-dissipating portion of each heatsink plate has one separating protrusion which contacts the heat-dissipating portion of an adjacent heatsink plate so that the heat-dissipating portion of each heatsink plate is displaced at an angle from the heat-dissipating portions of adjacent heatsink plates.

2 more elements

A heatsink for an electronic component comprising:

a plurality of heatsink plates, each of the heatsink plates having a binding portion and a heat-dissipating portion, each heat-dissipating portion including a plurality of heat-dissipating fins joined to the binding portion, wherein the heatsink plates are bound together at the binding portions to form a heat-absorbing portion for contacting a heat-dissipating surface of an electronic component, and at least some of the heat-dissipating portions of the heatsink plates are bent at respective angles relative to the respective binding portions of the heatsink plates to increase separation between adjacent heat-dissipating portions;
and
means for binding the plurality of heatsink plates together, wherein each heat-dissipating fin in the heat-dissipating portion of each heatsink plate has a separating protrusion contacting a heat-dissipating fin of a heat-dissipating portion of an adjacent heatsink plate, displacing the heat-dissipating fin from heat-dissipating fins of adjacent heatsink plates.

Dependencies are inferred from the claim text.

Heatsink for electronic component

Life of this patent

Heatsink for electronic component

Life of this patent

Abstract

Claims15