Heat-Shrinkable EMI/RFI shielding material
AssigneeMethode Electronics, Inc.
InventorsEmil Millas, Albert Chiapetta, Frank St. John
Life of this patent
Estimating the term…
Abstract
The present invention relates to a material for shielding electromagnetic interference (EMI) and radio frequency interference (RFI) between a, electrical conductor or bundle of conductors and the environment. The material comprises a heat-shrinkable woven fabric coated with a conductive material. Specifically, the material can be used as a jacket heat-shrinkable to fit with any sized wire, cable, data or signal line, antenna, or other electrical conductor. A method of making the material is also discussed. In the method, a heat-shrinkable woven fabric is coated with a conductive slurry. When the slurry is dried, a conductive material is deposited on the surface of the heat-shrinkable woven fabric.
Claims5
An EMI/RFI shielding material, comprising:
- a heat-shrinkable woven fabric having opposite first and second surfaces and a plurality of pores, said heat-shrinkable woven fabric being non-conductive;
- and
- a conductive coating layer formed on one of said first and second surfaces of said heat-shrinkable woven fabric.
Dependencies are inferred from the claim text.